Fujitsu plans a heatsink for smartphone

A small copper heatsink, with system heat pump, allows cooling the chip of mobile devices thanks to a reduced thickness and a configuration adapted to various needs

 Fujitsu has developed a new cooling solution turned to electronic devices of small dimensions. It is a heat sink with a thickness of only 1mm can transfer a quantity of heat five times higher than current sinks thin.

 Being able to effectively dispose of the heat generated by the operation of the chip is a growing problem for the world of mobile devices, since the SoC see a sudden increase in operating frequencies to meet the needs of high computational capabilities expressed by consumers. The cooling of the chip seems to be a matter of particular importance in view of the realization of smartphone and tablet performance increasing.

 Fujitsu has therefore devised a heat sink ring, where the part that takes care of the heat transfer consists of an evaporator that absorbs the heat of the source and of a capacitor that goes to dissipate heat: the two elements are connected in a loop by a small duct in which is located a cooling liquid. The heat generated by the chip causes the state transition of the liquid in the form of vapor moves to the condenser.

 The construction of the heatsink is made by stacking copper layers of 0.1 mm thick, perforated to facilitate the capillary action. This scheme is well suited to mobile devices since it allows to effectively transferring heat regardless of the orientation of the device. The layout of the pipe is flexible and can be customized according to the space available on your mobile device.

Fujitsu has already shown prototypes operating but the realization of a commercial product will occur no earlier than 2017. The technology could be used for other devices, although it is not made any specific reference.

Fujitsu plans a heatsink for smartphone