Huawei P9 will have a curved screen and engraved in 16nm SoC ?

The Chinese manufacturer already prepares the successor to the P8, according to some rumors circulating on the web. A new flagship which could also bring some new size…

 Shortly after releasing its P8, P8 Max and P8 Lite, Huawei is already working on P9. According to the site Mobile-Dad, the Chinese firm would in cartons a telephone whose code name “IP03″, suggests that it could act Huawei P9, as his predecessors P7 and P8 respectively were the names “IP01″ and “IP02″, before they are formalized.

 Sources familiar with the matter further asserts that this P9 could be very different P8, since it could have a curved screen and a fingerprint reader on the back of the device.

 The report also says that the future of the Chinese smartphone manufacturer could be equipped with a screen of 5.2 inches and a 16 megapixel sensor with OIS (optical image stabilization), already present on the LG G4. As for the processor, it could be the new HiSilicon Kirin 950. Huawei, which manufactures itself, should normally be able to reveal what Soc towards the end of the year, with an etching process in 16 nm introduced by TSMC.

 The question is whether Huawei plans to put on the same level as Apple, Samsung, HTC, LG and Sony, offering a high range equipped with the best components on the market flagship,

or wishes as with P8 offer a slightly lower unit to position it at a more affordable price than the market heavyweights.

 But we’ll have to wait to find out if all the rumors circulating about him are true today. P9 should indeed logically be announced in April 2016, so Huawei follows the classical rhythm, which is one year between each flagship. By then, things have time to change ..

Huawei P9 will have a curved screen and engraved in 16nm SoC ?